JewelBox X-Ray Images

High-Resolution Inspection for Electronics Fabrication Applications

Progressive magnification allows inspection of multiple details:

24X view of an IC The same IC at 65X

24X view of an IC

The same IC at 65X

ball bonds wedge bonds

At 250X, ball bonds may be inspected

Also at 250X, wedge bonds are revealed

Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on the right-most lead.

Image of a surface mounted IC

Image of a micro BGA, rotated, reveals wire sweeps and solder ball shape.

Image of a micro BGA

Solder joints on a flip chip: note the large number of voids in each joint and bridging at the left side.

Solder joints on a flip chip

Dimensional view of solder balls pinpoints the precise location of solder voids within the balls.

Dimensional view of solder balls

Die attach, showing voids in the epoxy connecting the silicon to the metal lead frame.

Die attach

 

 

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