BGA Inspection

SMT/BGA Inspection - Precision Images for Advanced Assembly


Many manufacturers of advanced SMT assemblies rely on real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems.

For assemblers who measure BGA solder voids to determine quality, Glenbrook's patented x-ray camera offers a unique advantage: it is the only system not subject to Voltage Blooming. Void sizes remain consistent at all voltages, providing reliable pass/fail data.

As an alternative to large packages with high pin counts, ball grid arrays (BGAs) have distinct benefits: smaller size, lower inductance, reduced coplanarity and lack of skewing. But once a BGA is placed, how can the integrity of its solder bond be measured?

Many manufacturers of advanced SMT assemblies rely on Glenbrook's real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems. In the course of working with our systems, these manufacturers have verified a fundamental principle of productive assembly: it's more effective to inspect the process, rather than the product.

Real-time x-ray inspection helps to establish quality as an integral part of your process, right from the start, and to maintain it throughout your line, for BGA evaluation or any other aspect of the process. In the development stage, real-time x-ray inspection defines the optimal parameters required to maintain a process in control. During production audits, it ensures that those parameters are being maintained.


A Family of X-ray Inspection Systems
Providing Affordable Choices
for Inspection of BGAs and Electronic Assemblies



Low Cost X-ray Inspection of Bare Boards and Plastic BGAs

The RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs and Flip Chips.The system is very versatile and features Glenbrook's patented, award-winning X-ray camera technology that generates high-resolution, high-sensitivity images, revealing defects as small as 0.001 inch with a full one inch diameter field of view. The RTX-113 provides affordable real-time X-ray imaging, reliable operation and easy servicing.

RTX-113 Micro-30
RTX-113 Micro-30™

Smaller Focal Spot for High Resolution Requirements such as Small Hole Drilling, Micro BGA and QFN Inspection

The new RTX-113 Micro 30 X-ray Inspection System, with enormous capability, is compact enough to fit in a lab or on the production floor. The system employs a pc controlled 40 to 80 kV x-ray tube with 30 micron focal spot and our patented XRTV x-ray camera technology now enhanced with Crystal X Imaging for higher contrast. This combination advances our RTX Series for higher resolution and magnification requirements allowing up to 100x geometric and 225x optical magnification.

JewelBox 70T

High Magnification X-ray Inspection of Electronic Assemblies

The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system's 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.

JewelBox Ultra-Compact

Compact, Desktop Version of the JewelBox

Glenbrook Technologies redefines X-ray Inspection with our smallest JewelBox Micro focus x-ray system yet. With dimensions of just 22”W x 26”L, it’s small enough to fit on a standard desk, in an office or small lab. But it’s big in capabilities with >500x magnification ,5 axis manipulator and advanced image processing.

To support SMT/BGA inspection, Glenbrook offers products for process development and quality assurance:

The World’s First BGA X-ray Reflow Movie

This video was captured using technologies developed by Glenbrook Technologies and described in patent numbers: 6,009,145 and 7,426,258. The video Continue Reading →


Assemblers figure 1

How Assemblers Use X-Ray Inspection for BGA

By Steven A. Zweig Ball grid array package handling has it own set of problems and requirements. In replies from Continue Reading →


Exposing BGA: Increase Yields with X-ray Inspection

By Gilbert Zweig The incorporation of BGA packages into electronics assembly has made inspection issues of these leadless components a Continue Reading →


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