Electronic Assembly White Papers
Our Electronic Assembly White Papers on X-ray Inspection offer valuable insights and practical case studies focused on multilayer and assembled printed circuit boards (PCBs). These studies showcase advanced X-ray techniques for inspecting components like Ball Grid Arrays (BGA), Quad Flat No-Lead (QFN) packages, Light Emitting Diodes (LEDs), and other electronic assemblies.
Our case studies include a worldwide perspective, offering valuable insights for electronic industries across the globe.
X-ray Inspection is Critical for Counterfeit Detection
Military distributor of OEMs explains how x-ray detection safeguards against counterfeit parts.
X-ray Inspection Verifies Quality of Complex PCBs
How x-ray technology ensures precision in multi-layer board development in the Netherlands.
EMS Firm Ensures Quality with X-ray Inspection
X-ray inspection system installed in 2008 continues to ensure consistent quality for Brazilian EMS firm specializing in assembling highly complex boards.
X-ray Inspection Supports Quality in Component Procurement
New York-based supply chain platform that automates sourcing, procurement, and delivery uses X-ray inspection for component authenticity.
X-Ray Supports Quality Assurance, Counterfeit Detection
An electronics manufacturer uses a reel-to-reel X-ray system for high-quality assemblies in Albuquerque, New Mexico.
X-Ray Supports Solder Paste Development
In Northern Europe, real-time X-ray inspection supports solder paste development and performance.