Multilayer PCB Fabrication

Among PCB fabricators, the RTX Series is the most widely used Glenbrook system

Since the company’s founding, Glenbrook’s real-time X-ray inspection systems have enabled fabricators of multi-layer PCBs to enhance product quality and control costs. The RTX series includes The RTX-113, The New RTX-113 MicroTech, and The RTX Backplane.

Inspection is performed following lamination, to determine the presence and degree of inner layer shifts. At the onset of either conventional or small hole drilling, inspection is used to qualify hole-pad alignment. In addition to enhancing product quality, X-ray inspection enables users to control costs by eliminating defective boards early in the production process.

RTX-113™

Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
The system is very versatile and features Glenbrook’s patented, award-winning X-ray camera technology that generates high-resolution, high-sensitivity images, revealing defects as small as 0.001 inch with a full one inch diameter field of view.
The RTX-113 provides affordable real-time X-ray imaging, reliable operation and easy servicing.

RTX-113 MicroTech For Small Hole Drilling

The new RTX-113 MicroTech X-ray Inspection System, with enormous capability, is compact enough to fit in a lab, or on the production floor. The system employs a pc controlled 40 to 80 kV x-ray tube with 30 micron focal spot and our patented XRTV x-ray camera technology now enhanced with Crystal X Imaging for higher contrast. This combination advances our RTX Series for higher resolution and magnification requirements allowing up to 100x geometric and 225x optical magnification.

Applications include Small Hole Drilling of PC Boards, BGA’s, Micro BGA’s, QFN, LED, Medical Devices to name a few. The X-ray system maintains extraordinary reliability for over 2,800 Glenbrook customers in 50 countries.

Designed for Large and Heavy Backplane Panels for Multilayer and Assembled PC Boards

RTX Backplane

The RTX Backplane x-ray inspection system can accommodate boards up to 36″ X 42″ weighing up to 40 pounds. It can also inspect up to 32-layer, 0.4 inch thick PCBs and easily detects inner layer errors and checks for hole-pad alignment during drilling. The RTX Backplane can also inspect solder bond integrity of BGAs, LEDs, die attach and Flip Chip locations, and drilled holes on both small and standard boards.

The RTX Backplane x-ray inspection system can accommodate boards up to 36″ X 42″ weighing up to 40 pounds. It can also inspect up to 32-layer, 0.4 inch thick PCBs and easily detects inner layer errors and checks for hole-pad alignment during drilling. The RTX Backplane can also inspect solder bond integrity of BGAs, LEDs, die attach and Flip Chip locations, and drilled holes on both small and standard boards.

GTI-3000 Drill Offset Tool

To resolve the challenge of verifying drilling registration for small holes, Glenbrook’s small-hole drilling package allows users to inspect both standard and small holes with speed, accuracy and reliability. All the detail required to inspect this advanced technology, as well as standard holes, may be observed with a full one-inch diameter field of view.