Electronic Assembly White Papers

Our Electronic Assembly White Papers on X-ray Inspection offer valuable insights and practical case studies focused on multilayer and assembled printed circuit boards (PCBs). These studies showcase advanced X-ray techniques for inspecting components like Ball Grid Arrays (BGA), Quad Flat No-Lead (QFN) packages, Light Emitting Diodes (LEDs), and other electronic assemblies.

 

Our case studies include a worldwide perspective, offering valuable insights for electronic industries across the globe.

X-ray Inspection is Critical for Counterfeit Detection

Military distributor of OEMs explains how x-ray detection safeguards against counterfeit parts.

X-ray Inspection Verifies Quality of Complex PCBs

How x-ray technology ensures precision in multi-layer board development in the Netherlands.

EMS Firm Ensures Quality with X-ray Inspection

X-ray inspection system installed in 2008 continues to ensure consistent quality for Brazilian EMS firm specializing in assembling highly complex boards.

X-ray Inspection Supports Quality in Component Procurement

New York-based supply chain platform that automates sourcing, procurement, and delivery uses X-ray inspection for component authenticity.

X-Ray Supports Quality Assurance, Counterfeit Detection

An electronics manufacturer uses a reel-to-reel X-ray system for high-quality assemblies in Albuquerque, New Mexico.

X-Ray Supports Solder Paste Development

In Northern Europe, real-time X-ray inspection supports solder paste development and performance.